At a speech in Beijing China, Anand Chandrasekher, Intel’s senior vice president, outlined coming processor platforms and new UMPC and Mobile Internet Devices that would be coming in the next couple of years.
The speech that Chandrasekher gave focused on two areas: new mobile product development in the sub-notebook category, and new technologies that will be integrated into their mobile processor chips and platforms.
Upcoming Mobile Intel Processor and Chipset Technologies
In order of time sequence, Intel confirmed the following upcoming technologies will be arriving soon.
- May 2007: Intel will launch the Santa Rosa processor platform for notebooks on May 9th. The platform includes a “next-generation” Core 2 Duo processor and the Intel 965 Express chipset. The processor will offer faster front side bus speed (FSB), faster clock speed options, integrated Wi-Fi 802.11n, an integrated Gigabit Ethernet Network connection, and optional Turbo Memory designed to decrease resume time from notebook hibernation.
- First Half of 2008: Santa Rosa will be refreshed with Intel’s “Penryn” platform. Penryn will include the new 45nm Hi-k technology that is designed to be more power efficient, cooler running, and still offer 20% better performance than today’s notebook processors.
- Second Half of 2008: Intel will introduce the Montevina platform, it will incorporate the technologies used in Penryn, but components will be 40% smaller and used in mini- and sub-notebooks. It will include integrated hardware for decode of high-def video. Wi-Fi and WiMAX will be integrated into the Montevina platform. WiMAX is seen as a next generation form of Wi-Fi and is currently becoming popular in Asian countries.
Upcoming Ultra Mobile Device Platform Technologies
Intel also more clearly defined where they’re going with the current Ultra Mobile Personal Computer (UMPC) platform in terms of technologies and device form factors. Intel is using the terms Mobile Internet Device (MID) for smaller non-QWERTY keyboard type devices used specifically browse the web while Ultra Mobile Personal Computer (UMPC) is reserved for the larger devices we see today such as the Samsung Q1.
Could the Apple iPhone be using the new Intel A100 processor? (view large image)
- First Half of 2007: Intel will be releasing a new platform called Intel Ultra Mobile platform (UMP) 2007 (formerly called “McCaslin”). The Intel Ultra Mobile platform 2007 is based on the Intel processor A100 and A110, the Intel 945GU Express Chipset and the Intel ICH7U I/O Controller Hub. It is believed that the A100 and A110 processors are based on the Intel Pentium M Dothan chipset used in full-sized notebooks two years ago.
- First Half of 2007: New UMPC devices will be released using the new Intel UMP 2007 platform. The Samsung Q1 Ultra and HTC Shift will both be released and use this. it is rumored that Apple will also be using one of the new UMP 2007 platform from Intel — but Apple of course has not said anything regarding this.
- First Half of 2008: Intel will be releasing a next-gen processor platform for UMPCs, built from the ground-up, called “Menlow”. The processor codename is “Silverthorne” and the chipset is named “Paulsbo”, together they comprise the new “Menlow” platform. Menlow will adopt the Intel 45nm Hi-k low power microarchitecture. Menlow will consume one quarter of what existing UMPC devices use — many of which use an ultra-low voltage Celeron Ms.
The HTC Shift, coming this summer, will use the new UMP 2007 platform from Intel (view large image)
The Samsung Q1 Ultra will also use the UMP 2007 processor platform (view large image)